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| Bulletin PD-20649 03/02 FD060U02A5B Fred Die in Wafer Form a c 0.35 0.01 (14 0.4) NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION (MILS): d b C A 3. DIMENSIONS AND TOLERANCES: a = 1.524 + 0, -0.01 (60 + 0, -0.4) b = 1.168 + 0, -0.01 (45.98 + 0, -0.4) c = 1.310 + 0, -0.01 (51.57 + 0, -0.4) d = 0.954 + 0, -0.01 (37.56 + 0, -0.4) 4. LETTER DESIGNATION: A = Anode (Top Metal) C = Cathode (Back Metal) 5. SAWING: Recommended Blade SEMITEC S1025 QS00 Blade Sawing Street 0.05 + 0, -0.005 (2 + 0, -0.2) 40 (1.57) Wafer flat alligned with side b of the die O 125 (4.92) NOT TO SCALE Reference IR Packaged Part: MURD620CT Series www.irf.com 1 FD060U02A5B Bulletin PD-20649 03/02 Electrical Characteristics (Wafer Form) Parameters VFM VRRM IRM trr Maximum Forward Voltage Mimunum Reverse Breakdown Voltage Max. Reverse Leakage Current Typ. Reverse Recovery Time Units 1.0 V 200 V 5 A 25 ns Test Conditions TJ = 25C, I F = 3 A TJ = 25C, I RRM = 100 A TJ = 25C, V RRM = 200 V I F = 1A, di F/ dt = 50A/s, V R = 30 V Mechanical Data Nominal Back Metal Composition, Thickness Nominal Front Metal Composition, Thickness Chip Dimensions Reject Ink Dot Size Recommended Storage Environment Cr - Ni - Ag (1 KA - 2 KA - 3 KA) 99% Al, 1% Si (3 microns) 0.060" x 0.046" (see drawing) 0.25 mm diameter minimum Storage in original container, in dessicated nitrogen, with no contamination Packaging Device # FD060xxxx5B FD060xxxx5R FD060xxxx5P FD060xxxx5F Description Inked Probed Unsawn Wafer (Wafer in Box) Probed Die in Tape & Reel Probed Die in Waffle Pack Inked Probed Sawn Wafer on Film Minimum Order Quantity Die in Sale Package 4800 6000 4800 4800 2 www.irf.com FD060U02A5B Bulletin PD-20649 03/02 Ordering Information Table Device Code FD 1 1 2 3 4 5 6 7 Fred Die 060 2 U 3 02 4 A 5 5 6 B 7 Chip Dimension in Mils: Process Voltage code Vrrm (*100) eg: Chip surface metallization: Wafer diameter in inches Packaging: 060 = 060x046 square U = UltraFast 02 = 200V A = Aluminium (anode), Silver (cathode) B = Inked Probed Unsawn Wafer (Wafer in box) Data and specifications subject to change without notice. This product has been designed and qualified for Industrial Level. Qualification Standards can be found on IR's Web site. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7309 Visit us at www.irf.com for sales contact information. 03/02 www.irf.com 3 |
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